Intel’s LEGO-Like Chiplet Design For Next-Gen Meteor Lake, Arrow Lake & Lunar Lake “3D Foveros” CPUs Detailed - Wccftech

Intel has further detailed its LEGO-Like Meteor Lake, Arrow Lake & Lunar Lake CPUs that utilize the 3D Foveros packaging technology.

Yesterday, we reported a few key details of Intel's next-gen CPUs which feature a very LEGO-Esque design thanks to the 3D Foveros packaging technology. The new CPUs that will be putting the tech to g… [+9871 chars]

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